First Call for Papers: 11th ACM SIGPLAN International Conference on Software Language Engineering (SLE 2018)

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First Call for Papers: 11th ACM SIGPLAN International Conference on Software Language Engineering (SLE 2018)

Andrei Chis-2
Call for Papers:
11th ACM SIGPLAN International Conference on Software Language Engineering (SLE 2018)
co-located with SPLASH 2018 
November 5-6, 2018
Boston, Massachusetts, United States 

We are pleased to invite you to submit papers to the 11th ACM SIGPLAN International Conference on Software Language Engineering (SLE 2018), held in conjunction with SPLASH 2018 at Boston, Massachusetts on November 5-6, 2018.


With the ubiquity of computers, software has become the dominating intellectual asset of our time. In turn, this software depends on software languages, namely the languages it is written in, the languages used to describe its environment, and the languages driving its development process. Given that everything depends on software and that software depends on software languages, it seems fair to say that for many years to come, everything will depend on software languages.

Software language engineering (SLE) is the discipline of engineering languages and their tools required for the creation of software. It abstracts from the differences between programming languages, modelling languages, and other software languages, and emphasizes the engineering facet of the creation of such languages, that is, the establishment of the scientific methods and practices that enable the best results. While SLE is certainly driven by its metacircular character (software languages are engineered using software languages), SLE is not self-satisfying: its scope extends to the engineering of languages for all and everything.

Like its predecessors, the 11th edition of the SLE conference, SLE 2018, will bring together researchers from different areas united by their common interest in the creation, capture, and tooling of software languages. It overlaps with traditional conferences on the design and implementation of programming languages, model-driven engineering, and compiler construction, and emphasizes the fusion of their communities. To foster the latter, SLE traditionally fills a two-day program with a single track, with the only temporal overlap occurring between co-located events.

Topics of Interest

SLE 2018 solicits high-quality contributions in areas ranging from theoretical and conceptual contributions, to tools, techniques, and frameworks in the domain of software language engineering. Topics relevant to SLE cover generic aspects of software languages development rather than aspects of engineering a specific language. In particular, SLE is interested in contributions from the following areas:

* Software Language Design and Implementation
      - Approaches to and methods for language design
      - Static semantics (e.g., design rules, well-formedness constraints)
      - Techniques for specifying behavioral / executable semantics
      - Generative approaches (incl. code synthesis, compilation)
      - Meta-languages, meta-tools, language workbenches
* Software Language Validation
      - Verification and formal methods for languages
      - Testing techniques for languages
      - Simulation techniques for languages
* Software Language Integration and Composition
      - Coordination of heterogeneous languages and tools
      - Mappings between languages (incl. transformation languages)
      - Traceability between languages
      - Deployment of languages to different platforms
* Software Language Maintenance
      - Software language reuse
      - Language evolution
      - Language families and variability
* Domain-specific approaches for any aspects of SLE (design, implementation, validation, maintenance)
* Empirical evaluation and experience reports of language engineering tools
      - User studies evaluating usability
      - Performance benchmarks
      - Industrial applications

Important Dates

All dates are Anywhere on Earth.

* Fri 29 June 2018 -  Abstract Submission
* Fri 6 July 2018 - Paper Submission
* Fri 24 August 2018 - Author Notification
* Fri 31 August 2018 - Artifact Submission
* Fri 5 October 2018 - Camera Ready Deadline
* Wed 10 October 2018 - Artifact Notification
* Fri 12 October 2018 - Deadline for Artifact-Related Paper Updates
* Sun 4 Nov 2018 - SLE Workshops
* Mon 5 Nov - Tue 6 Nov 2018 - SLE Conference

Types of Submissions

* Research papers
These should report a substantial research contribution to SLE or successful application of SLE techniques or both. Full paper submissions must not exceed 12 pages excluding bibliography.

* Tool papers
Because of SLE’s interest in tools, we seek papers that present software tools related to the field of SLE. Selection criteria include originality of the tool, its innovative aspects, and relevance to SLE. Any of the SLE topics of interest are appropriate areas for tool demonstrations. Submissions must provide a tool description of 4 pages excluding bibliography, and a demonstration outline including screenshots of up to 6 pages. Tool demonstrations must have the keywords “Tool Demo” or “Tool Demonstration” in the title. The 4-page tool description will, if the demonstration is accepted, be published in the proceedings. The 6-page demonstration outline will be used by the program committee only for evaluating the submission.

* New ideas / vision papers
New ideas papers should describe new, non-conventional SLE research approaches that depart from standard practice. They are intended to describe well-defined research ideas that are at an early stage of investigation. Vision papers are intended to present new unifying theories about existing SLE research that can lead to the development of new technologies or approaches. New ideas / vision papers must not exceed 4 pages excluding bibliography.

Workshops: Workshops will be organized by SPLASH. Please inform us and contact the SPLASH organizers if you would like to organize a workshop of interest to the SLE audience. Information on how to submit workshops can be found at the SPLASH 2018 Website:

Artifact Evaluation

For the third year SLE will use an evaluation process for assessing the quality of the artifacts on which papers are based to foster the culture of experimental reproducibility. Authors of accepted papers are invited to submit artifacts. More information will be announced on the Website.


Submissions have to use the ACM SIGPLAN Conference Format "acmart" (; please make sure that you always use the latest ACM SIGPLAN acmart LaTeX template (, and that the document class definition is \documentclass[sigplan,screen]{acmart}. Do not make any changes to this format!

Using the Word template is strongly discouraged.

Ensure that your submission is legible when printed on a black and white printer. In particular, please check that colors remain distinct and font sizes in figures and tables are legible.

SLE follows a single-blind review process. Thus, you do not have to blind your submission.

All submissions must be in PDF format.

Concurrent Submissions:
Papers must describe unpublished work that is not currently submitted for publication elsewhere as described by SIGPLAN’s Republication Policy ( Submitters should also be aware of ACM’s Policy and Procedures on Plagiarism ( Submissions that violate these policies will be desk-rejected.

Submission Site:
Submissions will be accepted at

Reviewing Process

All submitted papers will be reviewed by at least three members of the program committee.  Research papers and tool papers will be evaluated concerning novelty, correctness, significance, readability, and alignment with the conference call. New ideas / vision papers will be evaluated primarily concerning novelty, significance, readability, and alignment with the conference call.

For fairness reasons, all submitted papers must conform to the above instructions. Submissions that violate these instructions may be rejected without review, at the discretion of the PC chairs.


* Distinguished paper: Award for most notable paper, as determined by the PC chairs based on the recommendations of the programme committee.

* Distinguished reviewer: Award for distinguished reviewer, as determined by the PC chairs.

* Distinguished artifact: Award for the artifact most significantly exceeding expectations, as determined by the AEC chairs based on the recommendations of the artifact evaluation committee.


All accepted papers will be published in the ACM Digital Library.

The official publication date is the date the proceedings are made available in the ACM Digital Library. This date may be up to two weeks prior to the first day of the conference. The official publication date affects the deadline for any patent filings related to published work.

Program Committee

Andrew Black, Portland State University, USA
Erwan Bousse, TU Wien, Austria
Marco Brambilla, Politecnico di Milano, Italy
Ruth Breu, University of Innsbruck, Austria
Walter Cazzola, University of Milan, Italy
Marsha Chechik, University of Toronto, Canada
Tony Clark, Sheffield Hallam University, UK
Juan de Lara, Universidad Autonoma de Madrid, Spain
Thomas Degueule, CWI Amsterdam, Netherlands
Juergen Dingel, Queen's University, Canada
Tom Dinkelaker, Ericsson, Germany
Sebastian Erdweg, Delft University of Technology, Netherlands
Bernd Fischer, Stellenbosch University, South Africa
Esther Guerra, Autonomous University of Madrid, Spain
Daco Harkes, Delft University of Technology, Netherlands
Robert Hirschfeld, University of Potsdam, Germany
Michael Homer, Victoria University of Wellington, New Zealand
Dimitris Kolovos, University of York, UK
Ralf Lämmel, University of Koblenz-Landau, Germany
Marjan Mernik, University of Maribor, Slovenia
Gunter Mussbacher, McGill University, Canada
James Noble, Victoria University of Wellington, New Zealand
Bruno Oliveira, University of Hong Kong, China
Christoph Reichenbach, Lund University, Sweden
Jan Oliver Ringert, University of Leicester, UK
Bernhard Rumpe, RWTH Aachen University, Germany
Anthony Sloane, Macquarie University, Australia
Emma Söderberg, Google, Denmark
Mark van den Brand, TU Eindhoven, Netherlands
Tijs van der Storm, CWI Amsterdam, Netherlands
Eelco Visser, Delft University of Technology, Netherlands
Eric Walkingshaw, Oregon State University, USA
Andreas Wortmann, RWTH Aachen University, Germany
Vadim Zaytsev, Rain Code, Belgium


For additional information, clarification, or answers to questions, please contact the organizers by email: [hidden email].

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